The picture below shows the general shape of a SOIC narrow package, with major dimensions. Memory modules, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging. 0000015099 00000 n
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0000041486 00000 n If you don't have a planet, what good are gold bars? 0000002274 00000 n These are sometimes called "wide SOIC," as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called "wide SOIC.". A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. 0000008319 00000 n For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. 0000001405 00000 n Note: It's relatively common to find packages that contain other components than their designated ones, such as diodes or, Thin-shrink small-outline package (TSSOP), Learn how and when to remove this template message, "Package Dimensions: MSOP8/-TP, SSOP20/28, TSSOP16, TSSOP20/-TP, TSSOP24", Amkor Technology ExposedPad SOIC/SSOP Package. 6 0 obj << /Linearized 1 /O 8 /H [ 993 208 ] /L 41249 /E 39466 /N 1 /T 41012 >> endobj xref 6 28 0000000016 00000 n The exposed pad should be soldered directly to the PCB to realize the thermal and electrical benefits. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. 0000013223 00000 n 0000009859 00000 n
0000011387 00000 n �*��nu����=�\y����S�[��Ќ��j�����/g��|]����T�/����_������{sv�����wp��R\c1q���sy�Ѹd�[Ph�� �_.ּ��]7o�Bl���[k~mi�=dאA[�}rί��)Z��⬿�s&S����B>Ԉ0�������G���`���WwpǷ��͍�|t�G7�Ha�q�`�@��\�h�U���p�䰖 package outline drawing for 8-soic w/ exposed pad mf-po-d-0018, revision 1.0 see detail "a" 0.0075(0.19) 0.0098(0.25) 0.050(1.27) bsc 0.013(0.33) 0.020(0.51) seating plane 0.000(0.00) 0.006(0.15) 0.051(1.30) 0.067(1.70) top view front view side view bottom view note: 1) control dimension is in inches. М�o��"���e�2 But the footprint looks like SOIC. 0000034497 00000 n After SOIC came a family of smaller form factors with pin spacings less than 1.27 mm: Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.0256 inches (0.65 mm) or 0.025 inches (0.635 mm). This case is much smaller with a pitch of only 0.5 mm. List of integrated circuit packaging types, https://en.wikipedia.org/w/index.php?title=Small_outline_integrated_circuit&oldid=960316003, Short description is different from Wikidata, Articles needing additional references from December 2011, All articles needing additional references, Creative Commons Attribution-ShareAlike License, Thin-shrink small outline package (TSSOP), This page was last edited on 2 June 2020, at 08:20.